Presentation at OFC 2021 Demo Zone

The presentation at OFC 2021 Demo Zone was successful! Learn more about our presentation.

21.06.08

 

 

 

 

<20-min presentation at OFC 2021 Demo Zone Technical Session>

  *LIPAC showcased its new FOWLP platform technology – a 100Gbps transceiver, based on advanced packaging - at OFC 2021 Demo Zone

  *100G-SR4 prototype released using platform technology

  *On-board / co-packaged interconnect, a new paradigm for an optical communication module concept

  *Application of platform technology could be datacenter, optical interconnects industry, CPO, mobile sensor, and IoT sensor

 

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LIPAC Co., Ltd., a semiconductor start-up (Seoul, South Korea) offering the Ultimate Light Packaging Solution, presented ‘a New FOWLP Platform for Hybrid Optical Packaging – Demonstration on 100Gbps Transceiver’ at OFC2021 Demo Zone (7 June 2021, 7:30, US-PDT), one of the largest optical communication exhibitions in North America.

OFC 2021 Demo Zone is a place for global companies and academics to present their research and projects in the field of optical communication devices, systems, and networks.

In total, 18 papers were chosen to be presented at Demo Zone, with authors from nine countries including the US, Germany, and Hong Kong. LIPAC was the only paper selected from Korea, and the OFC 2021 exhibition and presentation were all in virtual format due to the Covid-19.

 

 

At Demo Zone, LIPAC Co., Ltd. introduced its FOWLP based on Optical Sub Assembly (OSA) to integrate the 25Gbps/ch VCSEL and Driver IC. During the presentation, a 100Gbps (25Gbps/ch x 4 channels) operation of VCSEL and photodiode using the FOWLP based platform was demonstrated. 

The FOWLP platform based on Advanced Semiconductor Packaging supports the wafer-level process, multi-chip packaging, and fine interconnect pitch with the smallest form-factor.

 

LIPAC offers its ‘All-in-One’ Hybrid Optical Package Platform based on the Advanced Semiconductor Package, a platform applied to fabricate a key component for the IEEE 100-SR4 optical transceiver. With this new package platform, LIPAC Co., Ltd. can fabricate a product which has an optical application: a high-speed optical transceiver for datacenter and 5G network backbone.

LIPAC Co., Ltd. aims to enter the optical interconnects market in 2022, to take advantage of this technological advancement. Such technological development is competitive in terms of considerable reduction of module size and thickness (270um), performance enhancement, and scaling up mass production capacity.

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​In addition to the transceivers, the Hybrid Optical Packaging Platform has a wide range of applications.

Co-packaging is possible for any kind of optical-electrical ICs on all wafers. It allows the package size to become compact because compact hybrid integration of the optical-electrical ICs is realized by the FOWLP without a substrate and wire-bonding.

It is also suitable for a higher bandwidth due to the reduction of parasitic components in the electrical interconnection.

The integrated lens and optics on the FOWLP surface result in reducing the optical alignment cost. Further, mass production is possible due to the wafer lever processing.

These features of the Hybrid Optical Packaging Platform will allow LIPAC Co., Ltd. to penetrate both domestic and international markets (US, China, EU) with the optical interconnect as well as CPO (Co-Packaged Optics), mobile ToF sensor, and IoT sensor.