LIPAC always welcomes passionate talents.
Please send your application to firstname.lastname@example.org and we will contact you after review.
3D simulation analysis for high-speed signal transmission packaging products, semiconductor packaging design and PCB transmission
Measurement of signal integrity of products under development/production
A new concept of semiconductor packaging process design that applies light
Selection and evaluation of materials optimized for the designed process and securing the accuracy of parts placement.
Light waveguide design
Lens and optical design
Design and measurement for optical connection module products