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  • Simulation, design and
    measurement for high-speed signal transmission products

    3D simulation analysis for high-speed signal transmission packaging products, semiconductor packaging design and PCB transmission

    Measurement of signal integrity of products under development/production

  • Materials and processes sector for semiconductor and optical
    packaging development

    A new concept of semiconductor packaging process design that applies light

    Selection and evaluation of materials optimized for the designed process and securing the accuracy of parts placement.

  • Silicon photonics Applied
    Technology Engineer

    Light waveguide design

    Lens and optical design

    Design and measurement for optical connection module products

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