As the data transmission speed on the server boards in data centers increases rapidly, technical issues such as power loss, heat dissipation and signal integrity become much critical. To resolve the issues, electrical data transmission on server boards needs to be replaced by optical solutions, and LIPAC provides the optimal optical packaging solutions for on-board optics and co-packaged optics in the sense of power loss, heat dissipation and signal integrity.
Required specifications/socket size can be changed according to customer request.